Feature :
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection.
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Product sales list:
1pcs AMTECH NC-559-ASM Flux
or
1pcs AMTECH NC-223-ASM Flux
or
1pcs KINGBO RMA-218 Flux
or
blue alloy putter
or
black alloy putter
We can wholesale. If you need large quantities, we can use DHL, FEDEX channels. Welcome to purchase!
Because the product is a paste, "AliExpress Standard Shipping" cannot deliver paste. We will choose a safer and faster logistics to send it. If it is different from your choice of logistics, thanks for your understanding!
SKU: 12000029023369851
Tags: Brand Name, Place Of Origin, Model Number, Certification, Compatible Phone Model 1, Particle Size
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